MX887DHTTR【PDF 6/6 页】MICROPOWER HALL-EFFECT SWITCH

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Sheet目录62

2页 3页 4页 5页 [6页]

INTEGRATED CIRCUITS DIVISION

MX887D

www.ixysic.com

R01

3.5 Mechanical Dimensions

3.5.1 MX887DHT TSOT23 3-Lead Package

3.5.2 MX887DHTTR Tape & Reel Packaging

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

Recommended PCB Land Pattern

2.60 / 3.00

(0.102 / 0.118)

0.10 / 0.25

(0.004 / 0.010)

0.37 / 0.47

(0.015 / 0.019)

2.80 / 3.00

(0.110 / 0.118)

0.75 / 0.90

.030 / 0.035)

0.95 BSC

(0.037 BSC)

1.50 / 1.70

(0.059 / 0.067)

0.35 / 0.51

(0.014 / 0.020)

0.00 / 0.10

(0.000 / 0.004)

0.70 / 0.80

(0.028 / 0.031)

1.90 BSC

(0.0748 BSC)

0.60 REF

(0.0236 REF)

0.25 BSC

(0.0098 BSC)

0.10 MIN

(0.004 MIN)

5?NOM

7?NOM

0?/ 8?/DIV>

1.05

(0.041)

2.70

(0.106)

0.95

(0.037)

0.60

(0.024)

otes: (Unless otherwise specified)

. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm

(0.004 inches) per side.

. Dimension E does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.

. Package top may be smaller than package bottom. Dimensions D and E1 are determined at the outermost extreme of the plastic body

N TE:T

im n i n n h wn m l wi h EDE

n r EIA-4 1-2

m n

mbossed Carrier

Top Cover

Tape Thickness

0.066 MAX.

(0.003 MAX.)

178 DIA.

(7.01 DIA.)

Dimensions

(inches)

=1.1 ?0.1

(0.043 ?0.004)

P=4.0 ?0.1

(0.157 ?0.004)

=3.2 ?0.1

(0.126 ?0.004)

=3.2 ?0.1

(0.126 ?0.004)

W=8.0 ?0.2

(0.315 ?0.008)

P=4.0 ?0.1

(0.157 ?0.004)

2.0 ?0.05

(0.079 ?0.002)

1.75 ?0.1

(0.069 ?0.004)

?.5, +0.1, -0

(?.059, +0.004, -0)

3.5 ?0.05

(0.138 ?0.002)

?.1 ?0.1

(0.043 ?0.004)

0.25 ?0.05

(0.001 ?0.002)

Specification: DS-MX887D-R01

〤opyright 2012, IXYS Integrated Circuits Division

12/22/2012

or additional information please visit www.ixysic.com

XYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and

eserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed

r implied. Except as set forth in IXYS Integrated Circuits Divisions Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability

hatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a

articular purpose, or infringement of any intellectual property right.

he products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into

he body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Divisions product may result in direct physical

arm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes

o its products at any time without notice.

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